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Product Categories

  • High-Density Arrays 

  • High-Speed Dual Row Strips (Mezzanine)

  • High-Speed Edge Cards 

  • Ultra Micro Interconnects 

  • Backplane Connectors 

  • Flyover® Next-Gen Systems 

  • High-Speed Assemblies 

  • Ultra Rugged Solutions & Hardware 

  • Power Systems 

  • Rugged I/O Systems 

  • Rugged Board-to-Board Systems 

  • Rugged High-Speed Systems 

  • Discrete Wire Cable Assemblies 

  • Standard Profile

  • Low-Profile Vertical 

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  • Perpendicular Right-Angle 

  • Coplanar Right-Angle 

  • Self-Nesting 

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  • IDC Cable Systems 

  • Search by Pitch 

  • FireFly™ Optical Transceivers 

  • Halo™ Next-Gen Mid-Board Optical Transceivers

  • Passive Optical Systems 

  • RF Cable Assemblies 

  • RF Connectors

  • RF Original Solutions

Recent Products

BE90A High-Performance Test Assembly

The 224 Gbps PAM4 SerDes characterization features 1.00 mm or 1.35 mm connections to instrumentation, performance up to 90 GHz, single or double row configurations, microstrip/CPW or stripline PCB transmission, and 50-ohm impedance.

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Si-Fly®️ LP Low-Profile, High-Density Interconnect

The ultra-low profile interconnect, positioned adjacent to the IC package, delivers ultra-high density enabling 25.6 TB aggregate with a path to 51.2 TB, supports 112 Gbps PAM4 per lane, is PCIe®️ 6.0/CXL®️ 3.1 capable, achieves 5x the reach of traditional PCB solutions, and bypasses the BGA to route signals directly from the silicon package through a long-reach cable.

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Featured Product Categories

.050" SEARAY™ High-Speed High-Density Open-Pin-Field Array Terminal

The product meets IPC class 3 standards, supports Analog Over Array™, offers up to 500 I/Os, 56 Gbps PAM4, SET Qualification (samtec.com/SET), and ELP™ certification for 5,000 cycles at 150ºC, with .050" pitch, 7–18.5 mm stack heights, and an Automotive A-Series option.

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.050" Tiger Eye™ High-Reliability Flexible Pin Count Socket Strip

The polarized double-row Tiger Eye™ Phosphor Bronze contact system supports up to 100 pins at .050" (1.27 mm) pitch, offers up to 8 Gbps performance, features vertical orientation, through-hole or surface mount termination, a lower-cost plating option, and an Automotive A-Series variant.

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About Samtec

Established in 1976 in New Albany, Indiana, Samtec is a globally recognized leader in electronic interconnect solutions. Renowned for their innovative designs and customer-centric approach, their extensive product portfolio includes high-speed connectors, optical systems and durable micro-pitch solutions.
Samtec's dedication to outstanding service is evident in their fast lead times, complimentary samples and comprehensive engineering support, powered by cutting-edge design tools. With a worldwide footprint and an integrated business model, they deliver customized solutions efficiently.
Consistently ranked #1 in customer satisfaction, Samtec is celebrated for its quality and dependability. Additionally, their commitment to sustainability, community involvement, and a people-focused approach distinguishes them in the interconnect industry.

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