July 2024 Newsletter

July 2024 Updates for Design Engineers 

Read the latest semiconductor and electronics news and updates. 

In this edition:

1. Intel Vs. Samsung Vs. TSMC: The Foundry Competition.

2. Nuvoton Technology Unveils M2L31 MCU: Enhanced Energy Efficiency and Performance. 

3. South African Government Re-Announces 2G and 3G Shutdown Dates.

Intel Vs. Samsung Vs. TSMC: The Foundry Competition

The three giants, Intel, Samsung and TSMC, are in fierce competition as they push their technological boundaries, aiming for rapid advancements and customized chip solutions. Each company is setting aggressive timelines for new chip generations, targeting significant performance enhancements and quicker delivery of custom designs. While their technological goals—such as 3D transistors and packages—are similar, their methodologies and architectures are increasingly diverging, highlighting areas of intense rivalry.

Transistor Scaling and 3D Configurations:

Transistor scaling is moving into the 18/16/14 angstrom range, with a potential shift from nanosheets and forksheet FETs to complementary FETs (CFETs). This shift is driven by the demands of AI/ML and the massive data volumes requiring processing. The use of processing element arrays with high redundancy is crucial for achieving higher yields. Chip designs incorporating numerous chiplets in a 2.5D configuration are becoming standard, especially for data centers and mobile devices. Further innovations include full 3D-ICs and hybrid configurations like 3.5D and 5.5D to manage physical effects like heat.

Rapid Customization and Heterogeneous Integration:

Mass customizations or rapid delivery of domain-specific designs are becoming a critical differentiator. This involves standards, innovative connectivity schemes and interdisciplinary engineering. Heterogeneous chiplet assemblies, using standards like Universal Chiplet Interconnect Express (UCIe) and Bunch of Wires (BoW), are the core to this trend. Intel is employing its Embedded Multi-Die Interconnect Bridge (EMIB) and thermal interface materials (TIMs) to manage heat, while TSMC and Samsung are developing similar technologies, with the latter’s I-Cube ETM and TSMC’s CoWoS and SoIC packages.

Unique Strategies and Synchronization:

Each foundry is employing unique strategies to stay competitive. Intel focuses on sockets for chiplets, Samsung has established mini consortia for specific markets and TSMC has introduced the 3Dblox language for modular design. Samsung’s proprietary 3DCODE system description language helps integrate various technologies within its ecosystem. Ensuring synchronization to prevent timing issues in chiplets remains a major challenge, with all three foundries aiming to simplify the design process for high-performance, low-power chips.

Scaling to Angstrom Levels:

Scaling processes down to the angstrom level is the pivotal area of competition between the three industry leaders. Intel plans to introduce its 18A (angstroms) process soon, followed by 14A. TSMC aims to add 16A by 2027, while Samsung targets 14A by the same year. These advancements are crucial for enhancing performance per watt and reducing latency, with all three foundries moving towards 3D-IC configurations. Samsung’s roadmap includes stacking a 2nm die on top of a 4nm die, while Intel’s Foveros Direct 3D allows stacking logic dies using hybrid bonds.

Innovative Power Delivery and Substrate Materials:

Intel’s PowerVia technology for backside power delivery and plans for glass substrates underscore the race towards novelty. TSMC and Samsung are also exploring glass substrates for better planarity and lower defectivity. These advancements are critical for supporting complex semiconductor ecosystems and delivering efficient, high-performance chips.

Market Leadership and Advanced Packaging

TSMC leads the foundry market with a 90% share of advanced chip production, excelling in process development kits and advanced packaging. The competition is increasingly about delivering customer-specific solutions efficiently, rather than merely advancing process nodes.

Intel, Samsung, and TSMC are locked in a competitive battle, pushing the boundaries of semiconductor technology through unique methodologies and architectures. Their focus on rapid customization, heterogeneous integration and advanced packaging solutions reflects the growing demand for high-performance chips driven by AI and data processing needs. Each foundry's approach to transistor scaling, 3D configurations, and innovative materials underscores the intense competition in this critical industry.

Nuvoton Technology Unveils M2L31 MCU: Enhanced Energy Efficiency and Performance

Nuvoton Technology has launched the NuMicro M2L31 series, an advanced microcontroller based on the Arm Cortex-M23 core, targeting applications requiring high performance and energy efficiency. The M2L31 series operates up to 72 MHz and features 64 to 512 Kbytes of ReRAM, 40 to 168 Kbytes of SRAM and operates within a voltage range of 1.71V to 3.6V and a temperature range of -40°C to 105°C.

ReRAM, or Resistive Random-Access Memory, is a next-generation embedded memory offering fast read/write speeds, low power consumption and superior durability. Unlike traditional flash memory, ReRAM does not require a page erase operation before writing, leading to quicker and more efficient data handling.

The M2L31 series is highly energy-efficient, with a normal run mode consuming 60 μA/MHz at 72 MHz and multiple power-down modes reducing consumption significantly. In the Normal Power-down mode, it operates with 55 μA, and in Deep Power-down mode, it consumes just 0.5 μA.

Key features include three Programmable Gain Amplifiers (PGA), three comparators, a 24-ch 12-bit Successive Approximation Register Analog-To-Digital Converter (SAR ADC) with 3.6 MSPS and two 12-bit Digital-To-Analog Converters (DAC). The series also supports USB Type-C Rev. 2.1 and USB Power Delivery Rev. 3.0, enhancing its versatility for modern applications.

Peripheral support is extensive, with options including RTC, up to 16 channels of PDMA, capacitive touch key sensing, CAN FD controllers, USB 2.0 FS OTG Host and device controllers, multiple UART, I²C, SPI/I2S and QSPI interfaces. The series comes in various packages, including WLCSP, QFN and LQFP options.

For development, the M2L31 series supports IDEs like Keil MDK, IAR EWARM and NuEclipse IDE with the GNU GCC compiler. It offers comprehensive development tools, including the NuMaker-M2L31KI evaluation board.

The M2L31 series targets applications such as motor control, PC peripherals, industrial automation and battery management systems. It stands out for its combination of low power consumption, high performance, robust security features and extensive peripheral support, making it suitable for various energy-efficient and high-performance applications.

To get the latest microcontroller solutions from Nuvoton, Contact McKinsey Electronics – Authorized distributor in the MENA region.

South African Government Re-Announces 2G and 3G Shutdown Dates

South Africa's Communications Minister Khumbudzo Ntshavheni announced plans to shut down the country's 2G and 3G networks by 31 December 2027, according to a policy document published in the Government Gazette. The document outlines a timeline for the transition to newer 4G and 5G technologies.

Key deadlines include:

• By September 30, 2024, the communications regulator ICASA must stop approving 2G- and 3 G-only devices.

  
  

• By December 31, 2024, network operators must cease activating 2G- and 3G-only devices, meaning no devices incapable of connecting to at least a 4G/LTE network can be added to their networks as of January 2025.

  
  

• By June 1, 2025, network operators must begin shutting down their 2G and 3G infrastructure.

  
  

• By December 31, 2027, the complete shutdown of 2G and 3G networks must be achieved.

This policy is part of the next-generation radio frequency spectrum for economic development, aiming to utilize high-demand spectrum for deploying newer technologies, particularly in rural and underserved areas. The transition road map is designed to be gradual and minimally disruptive.

The policy document highlights that spectrum and network licenses for major telecommunications operators in South Africa will start expiring as of 2028, with spectrum returning to ICASA for renewal or renegotiation of terms.

Nomvuyiso Batyi, CEO of the Association of Comms & Technology (ACT), representing major telecom operators, argued against a government-forced transition. Batyi advocated for a more supportive role by the state, allowing for an industry-led transition. She suggested actions like reducing import taxes on next-generation technology-enabled handsets to encourage consumer uptake.

Mobile operators like MTN and Vodacom are in various stages of preparing for this transition. MTN may switch off 3G first, while Vodacom had initially planned to turn off its 2G network by 2024. Telkom has already shut down most of its 2G services. However, the cost of 4G and 5G-compatible devices and the continued use of 2G IoT applications remains a challenge.

The new spectrum policy also calls for developing a "spectrum outlook" for South Africa, to be reviewed and updated every five years, providing an overview of market trends and advising on spectrum allocation and licensing.

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